Manufacturing Engineer – Microelectronics

Manufacturing Engineer – Microelectronics

Location: San Francisco, CA – Mission District

Work Arrangement: 100% On-Site

Employment Type: 6-Month Contract-to-Hire

Pay Rate: $55–$65/hr W2

We are seeking an experienced Manufacturing Engineer – Microelectronics to support the development and scale-up of high-precision manufacturing processes for high-volume production.

This is a highly hands-on engineering role working directly with manufacturing equipment, tooling, process development, validation, troubleshooting, and continuous improvement. The Manufacturing Engineer will also partner closely with design engineering to ensure new and existing products meet Design for Manufacturability (DFM) requirements.

Responsibilities

• Develop and optimize manufacturing processes, recipes, tooling, and equipment requirements for production.
• Support wire bonding, die bonding/die placement, adhesive dispensing, and encapsulation processes.
• Develop and validate manufacturing tooling and processes for high-volume production.
• Perform failure analysis, root-cause investigation, and implementation of corrective solutions.
• Improve process capability, yield, throughput, repeatability, and manufacturing efficiency.
• Troubleshoot technical issues involving manufacturing processes, equipment, tooling, and product assemblies.
• Analyze manufacturing and process data to identify trends and improvement opportunities.
• Collaborate with design engineers to achieve Design for Manufacturability (DFM) objectives.
• Recommend and implement design or process changes for sustaining products when required.
• Work directly with high-precision manufacturing equipment and testers.
• Support production readiness and transition of products/processes into higher-volume manufacturing.
• Participate in international travel as required.

Required Qualifications

• Bachelor's degree in Electrical Engineering, Mechanical Engineering, Mechatronics, or a related engineering discipline.
• 3–5+ years of hands-on microelectronics manufacturing experience.
• Experience with wire bonding, die placement/die bonding, adhesive dispensing, and encapsulation.
• Experience operating and troubleshooting high-precision manufacturing equipment.
• Experience working within a microelectronics and/or SMT manufacturing environment.
• Python programming/coding experience is required.
• Strong data analysis and manufacturing problem-solving skills.
• Experience performing failure analysis and root-cause investigations.
• Ability to work 100% on-site in San Francisco's Mission District.

Preferred Qualifications

• Hands-on experience with high-precision equipment such as DATACON, MRSI, or similar systems.
• Experience supporting manufacturing scale-up and high-volume production.
• Experience with process validation, process capability, yield improvement, and throughput optimization.
• Strong understanding of DFM and manufacturing process development.

Position Details

This is a 6-month contract-to-hire opportunity paying $55–$65/hr W2. Candidates must be comfortable working 100% on-site in San Francisco, CA (Mission District) and be available for international travel as required.

If you have hands-on microelectronics manufacturing experience involving wire bonding, die bonding/placement, adhesive dispensing, and Python, we encourage you to apply.