Program Manager

Program Manager – Semiconductor Packaging

Location: Bay Area, California

Salary: $120,000 – $190,000 Base + Benefits

Industry: Semiconductor / OSAT / Electronics Packaging

The Opportunity

We are working with a specialist semiconductor packaging and OSAT business in the Bay Area that is continuing to grow its customer base and technical capabilities.

They are looking to appoint a Program Manager to take ownership of customer programs from initial requirements through development, qualification and production.

This is a highly cross-functional role, working closely with customers and internal engineering, operations, manufacturing, quality and commercial teams to ensure programs are delivered on time, to specification and within budget.

What You'll Be Doing

• Own and manage multiple semiconductor packaging programs from project initiation through to production.
• Act as the key point of contact between customers and internal technical teams.
• Define project scope, timelines, milestones, resources and deliverables.
• Coordinate NPI, engineering development, qualification and production ramp activities.
• Manage customer requirements and ensure technical deliverables remain aligned with expectations.
• Identify and manage project risks, issues, dependencies and changes.
• Coordinate cross-functional teams across engineering, manufacturing, operations, quality and supply chain.
• Track program performance against schedule, cost, quality and customer requirements.
• Lead regular customer and internal program reviews.
• Support RFQs, technical proposals and new customer engagements where required.
• Drive continuous improvement throughout the program lifecycle.

What We're Looking For

We're particularly interested in candidates with experience in semiconductor packaging, OSAT or semiconductor manufacturing environments.

Relevant experience could include:

• Advanced semiconductor packaging
• IC packaging and assembly
• Semiconductor assembly & test
• Wafer-level packaging
• Flip-chip
• Wire bonding
• SiP / MCM
• Chiplet / heterogeneous integration
• NPI and semiconductor manufacturing
• Semiconductor process development

You should have proven experience managing complex technical programs, ideally involving multiple engineering and manufacturing functions.

Experience working directly with semiconductor customers and managing projects from development through qualification and into production would be highly valuable.

The Ideal Candidate

• Program / Project Management experience within semiconductors, electronics or advanced manufacturing.
• Strong understanding of semiconductor packaging or assembly processes.
• Comfortable managing technically complex, customer-facing programs.
• Strong communication and stakeholder management skills.
• Able to coordinate multiple projects and priorities simultaneously.
• Commercially aware with a strong focus on delivery and customer satisfaction.
• Experience with NPI, qualification and production ramp is highly desirable.

This is an excellent opportunity to join a specialist OSAT / advanced semiconductor packaging business at an important stage of its growth. You'll have the opportunity to work directly with leading semiconductor and technology companies, while playing a key role in delivering complex packaging programs from concept through to production.

Apply directly or message me for a confidential conversation.