Vice President Hardware Engineering

VP of HW Systems Engineering

Job Summary

We are seeking an agile, results-driven VP of HW Systems Engineering to lead our hardware organization. In this highly visible role, you will own the hardware product lifecycle from concept to high-volume production for Trusted Control/Compute Unit (TCU) products. This role requires an executive with elite, hands-on design and debugging capabilities who thrives in the lab and effectively navigates dynamic, supplychain-constrained environments. You will manage senior engineers and contractors, help customers build secure server infrastructure, and champion open hardware ecosystems such as the Open Compute Project (OCP).

Key Responsibilities

• Leadership & Execution: Drive TCU-based embedded systems from initial concept through high-volume production with active, hands-on daily execution.
• Mass Production & Yield: Take complex board designs to mass production while optimizing DFM/DFT, factory test coverage, and production yields.
• Sustaining & RMA Support: Oversee the technical resolution of customer field returns, driving Failure Analysis (FA) and corrective actions to improve reliability.
• Root-Cause Triage: Partner with cross-company ASIC, silicon, firmware, and software teams to systematically isolate and resolve complex system bugs.
• Lab Validation: Personally lead first-silicon and platform bring-up, low-level bus validation, and EVT/DVT testing in the lab.
• OCP & Industry Forums: Integrate OCP DC-SCM standards and represent the company within OCP and other industry hardware forums.
• Supply Chain Agility: Pivot board layouts responsively based on real-time parts availability and manage critical Tier-1 supplier relationships.
• Design & Review: Drive schematic development using Cadence OrCAD and collaborate with Layout, Mechanical, and SI engineers to meet OCP DC-SCM and NVIDIA IFF form factors.

Qualifications

• Experience & Education: 20+ years of hardware engineering experience with a leadership track record in server, data center, or semiconductor ecosystems. B.S. or M.S. in Electrical Engineering (EE).
• Production Track Record: Proven history of taking complex board designs to high-volume production with excellent yields and resolving field RMA issues.
• Hands-on Technical Mastery: Deep, continuous experience with circuit design, schematic capture, laboratory equipment, and platform troubleshooting.
• DC-SCM & Ecosystem Expertise: Strong knowledge of OCP DC-SCM standard solutions, including DC-SCI interfaces and form factors, along with a solid network across hyperscaler and OEM partners.
• Supply Chain Agility: Demonstrated capability to execute rapid hardware redesigns, footprint compatibility strategies, and alternative component sourcing.
• Tool & Interface Proficiency: Expert familiarity with Cadence OrCAD/Allegro and server interfaces including PCIe, USB, I2C, SMBus, SPI, UART, MCTP, eSPI, and LTPI.
• Architecture & Software Knowledge: Solid understanding of modern

CPU/GPU architectures and the Linux environment, including Python or Bash scripting.

• Communication: Exceptional verbal and written communication skills to articulate hardware-anchored security and supply chain strategies to enterprise stakeholders.